Our Products
Ashing Device
Our equipment effectively eliminates photoresist, a crucial masking material used in semiconductor wafer processing for circuit creation. Tailored to diverse applications, it offers customizable features. Compatible with wafer sizes of 150 mm and 200 mm, it ensures versatile functionality.
6500N
8500RN
λ3000N
Product Features
➧ Space-Saving Design: Reduced footprint for improved efficiency.
➧ Cost Savings: Achieved through compact control rack design.
➧ Enhanced Communication System: Includes strengthened noise countermeasures and Ethernet-based wiring for improved performance
➧ Optimized Transfer Robot: Utilizes a new, original transfer system design for enhanced efficiency.
➧ Reliable Control: Mitigates issues such as PC model change convergence and HDD failure by adopting PLC control
➧ High Throughput: Ensures efficient processing with high throughput capabilities.
➧ Low-Damage Batch Plasma Ashing System: Realizes minimal damage during batch processing.
Semiconductor Manufacturing Equipment
We operate within a fully equipped clean room (compatible with Class 5000 standards), specializing in the manufacturing of semiconductor front-end production equipment.
➧ Single-wafer Ashing Equipment
➧ Single-wafer Plasma Nitriding / Oxidizing Equipment
➧ Single-Wafer Annealing Equipment
➧ Batch Production Film Deposition Equipment
➧ Plasma Vacuum Equipment
➧ Plasma CVD Equipment
➧ Plasma Etching Equipment
➧ OLED Display Manufacturing Equipment